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Contact Person: Ivo Locher
Project Start: Autumn 2001
End: February 2006
Disseration No. 16467
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Providing the usual wearing comfort of clothing textiles as substrate for electronics intuitively emerge. Textiles must be able to embed conductive traces in order to be appropriate as PCB-like substrate. There already exist many types of conductive textiles such as fabrics with conductive polymer threads, conductively plated fabrics and fabrics with embedded copper fibers. Alternatively, a conductive layout can be screen-printed or jet-printed on a regular textile.
Investigation of the textile’s electrical properties is a fundamental requirement for later scientific work and reliable electrical circuit designs on textiles. |
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Currently, we focus on fabrics with embedded copper wires. Each copper wire itself is coated with an insulation varnish. We have developed methods to interconnect these copper wires along with a packaging process, which enables electrical circuits on textiles resulting in a System-on-Textile (SoT). SoT necessitates special design constraints for placement and routing.
Focus of our investigation is the electrical performance of textile interconnect and transmission lines. Earlier, we developed measurement processes in order to determine the transmission line characteristics of such textiles. Based on the measurement results, we designed simulation models for different wire configurations. Their characteristic impedance can be adjusted using different line configuration and cross-talk can be minimized with introduction of additional ground lines.
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